Product Capabilities for High Tech

Printed Antenna
Optomec’s Aerosol Jet® Printing enables precise, customizable antennas for 5G and wearable devices, optimizing design, material use, and prototyping

High Frequency RF Connects
Aerosol Jet® printing enables customized 3D interconnects for RF packages, optimizing impedance and loss characteristics for high-frequency applications

Print on Un-Packaged Die
Optomec’s Aerosol Jet® Printing enables precise, customizable interconnects on semiconductor dies, improving performance and efficiency in advanced electronics

Stacked Die DRAM
Optomec’s Aerosol Jet® Printing enables precise interconnects and packaging for stacked die DRAM, enhancing performance and reducing costs

Semiconductor Packaging
Optomec’s Aerosol Jet® Printing enables precise, cost-effective semiconductor packaging, supporting 3D ICs, system-in-package, and flexible electronics