Aerosol Jet Printing provides significant advantages in the direct printing of interconnects on un-packaged semiconductor dies. It allows for high-precision, low-loss, and customizable interconnects essential for RF, high-frequency, and advanced semiconductor applications. By enabling design flexibility, eliminating the need for wire bonding, and improving overall device performance, this technology supports the development of smaller, more efficient, and higher-performing electronics. Additionally, it enables faster prototyping and production cycles, reducing time-to-market for next-generation semiconductor devices. With its ability to precisely print on complex geometries, it also opens up new possibilities for integrating multiple components into a single, compact form factor.
Product Capabilities for High Tech
Printed Antenna
Optomec’s Aerosol Jet® Printing enables precise, customizable antennas for 5G and wearable devices, optimizing design, material use, and prototyping
High Frequency RF Connects
Aerosol Jet® printing enables customized 3D interconnects for RF packages, optimizing impedance and loss characteristics for high-frequency applications
Stacked Die DRAM
Optomec’s Aerosol Jet® Printing enables precise interconnects and packaging for stacked die DRAM, enhancing performance and reducing costs
Touch Screen Display
Aerosol Jet technology significantly enhances touchscreen displays by printing narrow interconnects, increasing usable area and reducing costs
Semiconductor Packaging
Optomec’s Aerosol Jet® Printing enables precise, cost-effective semiconductor packaging, supporting 3D ICs, system-in-package, and flexible electronics
Resources
Optomec Overview
Optomec is a leading provider of advanced 3D printing solutions, specializing in metal and functional electronics manufacturing. Their innovative technologies, including LENS (Laser Engineering Net…
Aerosol Jet Overview
Aerosol Jet systems are ideally suited to develop, fabricate, enhance and repair high performance electronic and biologic devices for Consumer Electronics, Semiconductor Packaging, Displays, Aerospace/Defense,…
LENS Materials FAQ
LENS systems process common engineering materials such as stainless steels, tool steels, titanium alloys, and cobalt alloys. LENS technology can also process other materials including…
LENS Materials
LENS Material Starter Recipes are time saving tools helping customers speed the development of new additive manufacturing applications. Developed by Optomec LENS application engineers and…
AEROSOL JET Materials
Aerosol Jet systems have the unique ability to directly print a wide range of electronic and biological materials onto almost any substrate. The AEROSOL JET…
AEROSOL JET MATERIAL STARTER RECIPES
Aerosol Jet Material Starter Recipes enable customers to save time and speed development of new printed electronic processes and applications. Developed by Optomec applications engineers…