Product Capabilities for High Tech
High Frequency RF Connects
Aerosol Jet® printing enables customized 3D interconnects for RF packages, optimizing impedance and loss characteristics for high-frequency applications
Print on Un-Packaged Die
Optomec’s Aerosol Jet® Printing enables precise, customizable interconnects on semiconductor dies, improving performance and efficiency in advanced electronics
Stacked Die DRAM
Optomec’s Aerosol Jet® Printing enables precise interconnects and packaging for stacked die DRAM, enhancing performance and reducing costs
Touch Screen Display
Aerosol Jet technology significantly enhances touchscreen displays by printing narrow interconnects, increasing usable area and reducing costs
Semiconductor Packaging
Optomec’s Aerosol Jet® Printing enables precise, cost-effective semiconductor packaging, supporting 3D ICs, system-in-package, and flexible electronics